Introduction:
This equipment is used for machining Mono-silicon bars. Cropping and sampling the hard and brittle materials through electroplated diamond wire with feeding process. It is a reliable, high-efficient and high precision equipment.
Equipment characteristics:
Bar Length: 6500mm (Max.)
1 blade per time
Cutting duration: 8 minutes
Equipment advantage:
Low cutting loss
High efficiency
Reliable performance
Technical Parameters:
|
Items |
Parameters |
|
Workpiece diameter |
φ200 – 300mm |
|
Workpiece length |
300 - 6500mm |
|
Wire diameter |
0.25 - 0.35mm |
|
Processing quantity |
2根 |
|
Segment length |
80 – 1000mm（樣片≥1.5mm） |
|
Cutting blade quantity |
2刀口 |
|
Feed speed |
0 – 1000mm / min |
|
Wire speed |
0 – 30m / s |
|
Wire length |
10000m（配套BS60工字輪，可直接上機切割） |
|
Wire tension |
0 – 130N |
|
Cutting time |
4min / 刀口 |
|
Wire consume |
3m / 刀口 |
|
Overall dimension |
≈5200×3800×2400mm |
|
Machine weight |
≈8000kg |
