Full-automatic Diamond Wire Multi-silicon Squaring Machine

            Introduction:

            GC-GP750 is an all-in-one machine for chamfering, grinding and polishing of different sizes of mono-silicon materials after squaring. It also has rough grinding, fine grinding, and chamfering function.


            Equipment characteristics:

            Low cost

            High production capacity

            Easy operation

            Compact structure and small floor space


            Advantages:

            1.Maximum speed of 45m/s, with high grinding efficiency

            2.Improve fast-speed blade matching, and repair empty travel

            3.Provided with cooling water pump booster to improve flow water rate and pressure and therefore increase grinding radiation efficiency.

            4.Provided with auto blade self-repair function to improve the precision of workpiece and cleanness.


            Technical parameters

            Items

            Parameters

            Workpiece types

            G6/G7/G8

            Workpiece size

            1400×1400×420(Max500)mm

            Wire diameter

            0.35 - 0.42mm

            Max. wire storage

            10km * 2

            Squaring diameter

            155mm ~166mm

            Feed speed

            0~3.5mm / min

            Wire consume

            900m/ silicon ingot

            Wire speed

            0 ~ 25m / s

            Wire tension

            0 ~ 140N

            Overall dimension

            10000(L)×3200(W)×3800(H)mm

            Machine weight

            30000kg


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