GC-700 Silicon Wafering Machine

            Equipment introduction

            Using diamond wires to form a wire net which is controlled by servo synchronous motor to realize high speed cutting, this equipment meets national advanced standard.

            Equipment function:

            50-70μm Superfine electroplated diamond wire                               

            Servo synchronous high-speed cutting

            Cutting bar length 750mm(max850mm)

            Wire speed 1800m/min

            Small wheelbase cutting


            Equipment advantages:

            Low seam loss

            Low cutting cost

            Low cutting time

            High speed and high production

            High silicon cutting productivity


            Technical parameters:

            Items

            Parameter

             Max. workpiece size

            Max. □156mm×L750mmMax.850mm 

            Wire moving mode

            One way or Reciprocating

            Max.  wire speed

            1800m/min

            Shaft centre distance

            385mm

            Wire diameter

            50~70μm

            Wire tension

            4~20N

            Wafering mode

            Downward cutting

            Feed speed

            0.1~5mm/min

            Max. wire storage

            200km

            DimensionsL×W×H

            4400mm×2000mm×2900mm

            Machine weight

            14000kg

             


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