Silicon Waering Diamond Wire

            Silicon Waering Diamond Wire

            Product Type

            Core Diameter (μm)

            Diamond Wire Diameter (μm)

            Breaking Force(N)

            Single roll maximum length(km)

            Application

            Electroplated Diamond Wire

            60

            75±3

            ≥13

            50

            Silicon Wafering

            65

            80±3

            ≥15

            70

            85±3

            ≥17.5

            80

            95±3

            ≥21

            Resin Diamond Wire

            70

            87±3

            ≥12

            70

            Silicon Wafering

            80

            97±3

            ≥19


            Electroplated Diamond Wire used for magnetic materials

            Product model

            High-carbon wire diameter(μm)

            Finished wire diameter(μm)

            Breaking force(N)

            Max. Length of single roller(Km)

            Application

            Electroplated Diamond Wire

            120

            170±10

            40

            30

            Magnetic materials

            130

            200±10

            45

            30

            Magnetic materials


            Technical parameters (for silicon cutting):

            Product model

            Base wire diameter(μm)

            Finished wire diameter(μm)

            Breaking force(N)

            Max. Length of single roller(Km)

            Application

            Electroplated Diamond Wire

            50

            63±3

            10

            50

            Silicon materials

            55

            68±3

            11

            60

            75±3

            13

            65

            80±3

            15

            70

            85±3

            17.5

            80

            95±3

            21



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