Mono809 Mono-silicon Cutting Machine

            Equipment Introduction

            The product named Mono807 Diamond Wire mono-silicon cutting machine is a machine using a diamond wire to cut and process mono-silicon ingots.It employs a processing technique in which silicon ingots are cut into sections with head and tailing ends cut off through a diamond wire reciprocating at high speed and complex control system. This machine is mainly used for processing mono-silicon , can simultaneously cause seven cuts and is a new machine with reliable functionality, high cutting efficiency and high processing accuracy.

            Equipment Feature:

            · Cutting stick length up to 4500mm

            · Everything can be cut 7 knife edge

            · 30 minutes to complete a cutting

            Euipment Advantage:

            · Low cutting loss

            · High efficiency

            · Reliable function

            Technical Parameter:

            Items

            Parameters

            Workpiece diameter

            φ150 – 270mm

            Workpiece length

            1000 - 5000mm

            Wire diameter

            0.25 - 0.42mm

            Processing quantity

            1

            Segment length

            230 – 850mm

            Cutting blade quantity

            9刀口(可根據需求增減奇數個)

            Feed speed

            0 – 300mm / min

            Wire speed

            0 – 25m / s

            Wire length

            10000m(配套BS60工字輪,可直接上機切割)

            Wire tension

            0 – 130N

            Cutting time

            2min / 刀口

            Wire consume

            2m / 刀口

            Overall dimension

            7150×1262×2263mm

            Worktable dimensions

            5270×864×775mm

            Machine weight

            12000kg


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