Poly306 Multi-silicon Brick Cutting Machine

            Equipment Introduction

            The product named Poly306 Diamond Wire Multi-silicon Cutting Machine is a machine using a diamond wire to cut and process muiti-silicon brick. It employs a processing technique in which silicon bricks are cut into sections through a diamond wire reciprocating at high speed. This machine is mainly used for processing multi-silicon , can simultaneously cut several bricks and is a new machine with reliable functionality, high cutting efficiency and high processing accuracy,low footprint.,convenient in operation, and also can be configured with machine hand to reduce workload or can be configured with robot for automatic production line.

            Technical Parameter:

            Items

            Parameters

            Workpiece size

            160×160×450mm

            Wire diameter

            0.3 - 0.45mm

            Feed speed

            1 – 30mm / min

            Wire speed

            0 – 25m / s

            Acceleration time

            3s

            Wire consume

            3m / 刀口

             Processing quantity

            6

            Cutting time

            8min

            Worktable moving speed

            0 – 300 mm / min

            Max. wire storage

            10000m(配套BS60工字輪,可直接上機切割)

            Wire tension

            0 – 130N

            Overall dimension

            3400×2300×1900mm

            Machine weight

            6000kg


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